| Counterfeit ICs present a serious threat to the electronics industry. Silicon Cert Laboratories offers in-house services to assist in determining whether your components are genuine or potentially counterfeit. While the initial step is to thoroughly review the manufacturing and shipping documents accompanying the shipment, the following processes would then be appropriate to conduct a more in-depth assessment. |
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External device inspections: visual & material analysis
| Type of Test |
Criteria |
Visual Inspection |
Inspect for workmanship of marking (e.g. sharpness, clarity)
Inspect for evidence of physical alteration (e.g. re-code marking)
Check part numbers and logos of actual products
Inspection of leads & pins for straightness, workmanship, gouges, residual solder |
Critical physical dimensions |
Verify dimensions to OEM datasheet |
Blacktop Inspection / Resistance to Solvents |
Inspection and solvent test for presence of blacktopped coating
Marking permanency testing on inked products |
Material Analysis:
SEM/EDS, optical microscopy |
Analysis of lead finish/solder, metal/ceramic package composition, stains, residues that indicate questionable processing, handling or storage |
Non-invasive internal analysis: imaging & hermeticity
| Type of Test |
Criteria |
X-ray Real-time imaging |
Presence/size of die; Device & wire-bond workmanship |
Scanning Acoustical Microscopy |
Presence/size of die; Quality of molding ( delamination ) |
Fine / gross leak testing of hermetic packages |
Confirm quality of hermetic seal |
Internal visual inspection (destructive physical analysis)
| Type of Test |
Criteria |
Decapsulation / delidding of packages |
Several methods are available to expose the die and other internal components of the device |
Visual inspection |
Comparison of die logos, part numbers & other internal identification features. Inspection of die for critical dimensions and workmanship including wire-bond quality |
Electrical parametric testing: When required, parametric testing is normally the final step in the detection process as it can be the most time-consuming to perform. This testing can include DC testing at 25°C and other appropriate temperatures, functional testing at 25°c and burn-in.
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