Mismatch of thermal coefficients of expansion of materials used in electronic and optoelectronic components are among the leading contributors to the failure of equipment exposed to extreme temperature variations. Repeated exposure to cyclic temperature variations can fatigue joints of different materials and cause them to fail. Conducting temperature cycling testing on these components will assist in determining the existence of thermal coefficient mismatches and the sensitivity of these mismatches to repeated temperature excursions.

Temperature cycling is performed in chambers that control the number of cycles, dwell times, transfer times or ramp rates and temperature extremes. Component manufacturers will often perform temperature cycling experiments far beyond the required test specifications to ascertain eventual failure modes. In particular, temperature cycling to failure will be performed on a limited quantity of samples for informational purposes only.