JESD22-A113 is the test method that establishes an industry standard preconditioning sequence for non-hermetic solid state surface mount devices (SMDs) that are subjected to multiple solder reflow operations. The SMDs should be subjected to the appropriate preconditioning sequence referenced in this JEDEC document prior to being submitted to specific reliability testing to evaluate the long term reliability.

Prior to subjecting the SMD part to the preconditioning sequence, its’ moisture sensitivity level (MSL) should first be established. This level will dictate storage times for unsealed devices awaiting assembly. This test should be performed at the highest temperature that the SMD is expected to see during its’ actual assembly.