Silicon Cert Laboratories
(SCL) is pleased to announce IC package decapsulation as part
of our growing list of services. Our decapsulation techniques
allow for the decapping of a wide range of package types and
Decapsulation is a chemical etching technique for opening
IC plastic packages in order to expose their internal components
for examination. Although physically destructive in nature,
the process leaves the die, bond pads, and wire bonds intact.
Several methods of decapsulation are available depending upon
the device and the customer’s requirements. Such methods
include jet etching, manual cavity etching, and total package
removal. Fuming nitric acid (HNO3), sulfuric acid (H2SO4)
or a mixture of the two acids are used to dissolve the encapsulant.
Jet etching is an automated version of chemical decapsulation.
The jet etcher dispenses a stream of acid onto the package
creating a cavity and exposing the die. With manual etching,
a depression is first milled into the surface of the package
after which acid is dropped into the cavity to dissolve the
encapsulant over the die. Total package removal is performed
by dissolving the entire package in a beaker of sulfuric acid
leaving only the silicon die and some amount of undissolved
metal. This last technique is primarily used to inspect for
cracks on the back of die.
Decapsulation of IC packages is just one of several services
offered by SCL to provide FAILURE ANALYSIS (FA) utilizing
electrical testing, cross-sectioning, Scanning Electron Microscopy
(SEM), and data analysis. For information about any of these
services, please call 610.939.9500.
Please watch for our future newsletters announcing our newly
expanded website and additional services such as Scanning
- Mechanical Shock
- Accelerated Bias Aging
- High/Low Temperature Storage
- Temperature Cycling
- Damp Heat / THB
- Cyclic Moisture
- ESD Threshold (HBM)
- Thermal Shock
- Fine & Gross Leak Detect
- Tin Whisker Growth
- Specialized Burn-in