Issue No. 1 - (5/24/02 - Temperature Cycling Testing)


Temperature Cycling Testing

Environmental Testing – Why?
Since today’s consumers and businesses expect totally fault-free operation and uninterrupted service, tests must be devised in order to guarantee performance. Environmental testing is part of the testing that is conducted to determine a component’s ability to perform during, or after exposure to a specific environment.

These tests are designed to assess the basic design of the device as well as the fabrication methods and materials used. Passing these tests is an indicator that the device will indeed be robust enough to provide long-term reliability. In addition, environmental tests assist in determining a device’s safe and proper operation and its operational limits.

Temperature Cycling

Mismatch of thermal coefficients of expansion of materials used in electronic and optoelectronic components are among the leading contributors to the failure of equipment exposed to extreme temperature variations. Repeated exposure to cyclic temperature variations can fatigue joints of different materials, and cause them to fail. Conducting temperature cycling testing on these components will assist in determining 1) the existence of thermal coefficient mismatches, and 2) and the sensitivity of these mismatches to repeated temperature excursions. Temperature cycling is performed in chambers that control number of cycles, dwell times, transfer times or ramp rates, and temperature extremes. Oftentimes, component manufacturers perform temperature cycling experiments far beyond Telcordia or MIL specifications to ascertain eventual failure modes. In particular, temperature cycling to failure will be performed on a limited sample for information only.

Don’t forget- Silicon Cert Ltd, as a leading reliability testing company with many years of experience can economically perform the Temperature Cycling Test as well as other reliability tests, including:

• Mechanical Shock
• Damp Heat
• Vibration
• Cyclic Moisture
• Accelerated Bias Aging
• ESD Threshold
• High/Low Temperature Storage

Then, after these tests are performed and if parts have failed, Silicon Cert is equipped to provide complete failure mode analysis (FMA) utilizing data analysis, electrical testing, and Scanning Electron Microscopy (SEM), providing a comprehensive report of the findings. All to help YOU in providing the finest, high reliability devices for YOUR customer!

FOR MORE INFORMATION PLEASE CONTINUE TO OUR WEBSITE.
OR CALL US IN READING , PA AT: 610-939-9500