Counterfeit Detection
Counterfeit components in the electronics industry are becoming a serious threat to our economy and our safety. Silicon Cert Laboratories offers in-house services to assist in determining whether your components are genuine or potentially counterfeit. The following analysis or test could be performed to conduct an in-depth assessment of your parts.
External device inspections: visual & material analysis |
Non-invasive internal analysis: imaging & hermeticity |
Internal visual inspection (destructive physical analysis) |
Visual Inspection |
X-ray Real-time imaging |
Decapsulation / delidding Type of Test of packages |
Critical physical dimensions |
Blacktop Inspection / Resistance to Solvents |
Scanning Acoustical Microscopy |
Visual inspection |
Material Analysis: SEM/EDS, optical microscopy |
Fine / gross leak testing of hermetic packages |
Silicon Cert Laboratories is an affiliate member of ERAI which is an information services organization that monitors, investigates, and reports issues affecting the global hi-tech electronics supply chain. SCL is also represented on the SAE G-19 committee which is chartered to address aspects of preventing, detecting, responding to and counteracting the threat of counterfeit electronic components.
Example of a package indent on an exemplary part |
Image of an indent of a suspect part. The coarse surface texture and scratches indicate probable sanding and resurfacing of the package. |
Reliability Testing
SCL, as a leading reliability testing company with many
years of experience, can economically perform other
reliability tests, including:
- Mechanical Shock
- Vibration
- Accelerated Bias Aging
- Random Vibration
- Thermal Shock
- Temperature Cycling
- Moisture Sensitivity Level (MSL)
- High Temperature Storage
- Preconditioning
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- Damp Heat / THB
- PIND
- Cyclic Moisture
- Resistance to Solvents
- Fine & Gross Leak Detect
- Tin Whisker Studies
- Low Temperature Storage
- Fiber Integrity
- Autoclave
- HAST
- Solderability
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- Scanning Electron Microscopy (SEM)
- Optical Microscopy
- Auger Electron Spectroscopy (AES)
- Precision Cross-Sectioning
- Package Decapsulation
- Acoustical Microscopy (CSAM)
- Material & Contamination Analysis
- Energy Dispersive Spectroscopy (EDS)
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