Issue No. 28 - (7/10/09 - Our Name Has Changed!)

 


Our Name Has Changed!!  

As of July 1st, we have changed our name to Silicon Cert Laboratories as the result of an ever-widening scope of in-house reliability testing and analytical services offerings. “With the additional testing and analytical services that have been added during the past two years”, states Managing Director Tom Speakman, “and those that are coming on-line this summer, we believe that identifying ourselves as a laboratory better reflects the breadth of what we can now offer our clients”. While our name has changed, our goal to provide continued excellent service has not!



A Summer of Audits

The Summer of 2009 will be known as the “Summer of Audits” for Silicon Cert Laboratories’ personnel. Beginning in late May, SCL was re-audited by DSCC (Defense Supply Center, Columbus) to eleven MIL-SDTD-883 test methods. In addition to successfully passing the DSCC audit, a site survey was then conducted by one of the largest military suppliers to the government (proprietary reasons not allowing their disclosure). In early August, Silicon Cert Laboratories is scheduled to be assessed for ISO/IEC 17025 accreditation by A2LA (the American Association for Laboratory Accreditation) for numerous test methods. Lastly, DNV (Det Norske Veritas) will be conducting an audit of SCL in late August for certification to ISO 9001:2008 which is replacing the previous ISO 9001:2000 standard.


Upcoming New Capabilities

In an effort to offer an even greater variety of services, Silicon Cert Laboratories is in the process of installing a Fein Focus x-ray imaging system and a Sonix scanning acoustical microscope. Having in-house x-ray capability will benefit failure mode analysis and counterfeit detection efforts, while the Sonix system will allow for thru-scan analysis during failure mode analysis and moisture sensitivity level testing.


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SCL, as a leading reliability testing company with many years of experience, can economically perform other reliability tests, including:

  • Mechanical Shock
  • Vibration
  • Accelerated Bias Aging
  • Random Vibration
  • Thermal Shock
  • Temperature Cycling
  • Moisture Sensitivity Level (MSL)
  • High Temperature Storage
  • Preconditioning
  • Damp Heat / THB
  • PIND
  • Cyclic Moisture
  • Resistance to Solvents
  • Fine & Gross Leak Detect
  • Tin Whisker Studies
  • Low Temperature Storage
  • Fiber Integrity
  • Autoclave
  • HAST
  • Solderability
  • Scanning Electron Microscopy (SEM)
  • Optical Microscopy
  • Auger Electron Spectroscopy (AES)
  • Precision Cross-Sectioning
  • Package Decapsulation
  • Acoustical Microscopy (CSAM)
  • Material & Contamination Analysis
  • Energy Dispersive Spectroscopy (EDS)