CONSTANT ACCELERATION TESTING
Constant acceleration testing is performed to determine the effects of constant acceleration on microelectronics devices. This test is designed to indicate types of mechanical and structural weaknesses not necessarily detected in vibration or mechanical shock testing. Constant acceleration is a high-stress test used to determine the mechanical limits of the package and other elements such as the internal metallization and lead system, the attachment of its die or substrate, and the robustness of its wire bonds.
At lower, non-destructive levels of stress settings it may also be utilized as a 100% in-line screen to detect and eliminate packages that exhibit lower than nominal mechanical strengths in any of its structural elements. Unless specified otherwise, the required constant acceleration value shall be applied to each of the package’s six orientations. For packages with internal elements mounted with the major plane perpendicular to the Y axis, the Y1 orientation is defined as the one that tends to displace the elements from their mount.

Silicon Cert achieved Commercial Laboratory Suitability Status for MIL-STD-883G, Method 2001, AàF, constant acceleration testing through the Defense Logistics Agency, Defense Supply Center, Columbus (DSCC). SCL’s Suitability Letter for this and other ten other MIL-STD-883G test methods can be viewed here.
Silicon Cert also offers the following reliability testing & analytical services. For more information including constant acceleration test pricing, please call us at 610-939-9500.
Reliability Testing
SCL, as a leading reliability testing company with many
years of experience, can economically perform other
reliability tests, including:
- Mechanical Shock
- Vibration
- Accelerated Bias Aging
- Random Vibration
- Thermal Shock
- Temperature Cycling
- Moisture Sensitivity Level (MSL)
- High Temperature Storage
- Preconditioning
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- Damp Heat / THB
- PIND
- Cyclic Moisture
- Resistance to Solvents
- Fine & Gross Leak Detect
- Tin Whisker Studies
- Low Temperature Storage
- Fiber Integrity
- Autoclave
- HAST
- Solderability
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- Scanning Electron Microscopy (SEM)
- Optical Microscopy
- Auger Electron Spectroscopy (AES)
- Precision Cross-Sectioning
- Package Decapsulation
- Acoustical Microscopy (CSAM)
- Material & Contamination Analysis
- Energy Dispersive Spectroscopy (EDS)
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