IC Counterfeit Detection
Counterfeit ICs present a serious threat to the electronics industry. Silicon Cert Laboratories offers in-house IC Counterfeit Detection services to assist in determining whether components are genuine or potentially counterfeit. While the initial step is to thoroughly review the manufacturing and shipping documents accompanying the shipment, the following processes would then be appropriate to conduct a more in-depth assessment. IC Counterfeit detection entails both external device inspection and internal device inspection. Process such as Visual Inspection, Physical Dimensions, Resistance to Solvents, Scanning Electron Microscopy, Energy Dispersive Xray Spectroscopy, Optical Microscopy, XRAY Imaging, Scanning Acoustical Microscopy, and Decapsulation are used to determine counterfeit parts. Silicon Cert Laboratories is your choice for IC counterfeit detection analysis.
Below is a description of the types of IC counterfeit detection tests along with the criteria for each.
External Device Inspections: Visual and Materials Analysis
Visual Inspection Inspect for workmanship of marking (e.g. sharpness, clarity)
Inspect for evidence of physical alteration (e.g. re-code marking)
Check part numbers and logos of actual products.
Inspect leads and pins for straightness, workmanship, gouges, and residual solder.
Critical Physical Dimensions Verify dimensions to OEM datasheet.
Non-Invasive Internal Analysis: Imaging and Hermeticity
X-ray Real-Time Imaging Presence/size of die; Device and wire-bond workmanship.
Scanning Acoustical Microscopy Presence/size of die; Quality of molding (delamination).
Internal Visual Inspection (Destructive Physical Analysis)
Decapsulation/ Several methods are available to expose the die and other internal components
Delidding of Packages of the device.
Visual Inspection Composition of die logos, part numbers, and other internal identification features.
Inspection of die for critical dimensions and workmanship, including wire-bond quality.
Electrical Parametric Testing
When required, parametric testing is normally the final step in the detection process because
it can be the most time consuming to perform.
Electrical parametric testing can include DC testing at 25°C and other appropriate temperatures,
functional testing at 25°C, and burn-in.