IC Counterfeit Detection


Counterfeit ICs present a serious threat to the electronics industry.  Silicon Cert Laboratories offers in-house IC Counterfeit Detection services to assist in determining whether components are genuine or potentially counterfeit.  While the initial step is to thoroughly review the manufacturing and shipping documents accompanying the shipment, the following processes would then be appropriate to conduct a more in-depth assessment.  IC Counterfeit detection entails both external device inspection and internal device inspection.   Process such as Visual Inspection, Physical DimensionsResistance to SolventsScanning Electron Microscopy, Energy Dispersive Xray Spectroscopy, Optical MicroscopyXRAY Imaging, Scanning Acoustical Microscopy, and Decapsulation are used to determine counterfeit parts.  Silicon Cert Laboratories is your choice for IC counterfeit detection analysis.

Below is a description of the types of IC counterfeit detection tests along with the criteria for each.

External Device Inspections:    Visual and Materials Analysis

                    Visual Inspection                                     Inspect for workmanship of marking (e.g. sharpness, clarity) 
                                                                                       Inspect for evidence of physical alteration (e.g. re-code marking)  
                                                                                       Check part numbers and logos of actual products. 
                                                                                       Inspect leads and pins for straightness, workmanship, gouges, and residual solder

                    Critical Physical Dimensions                 Verify dimensions to OEM datasheet. 

                    Blacktop Inspection/                               Inspection and solvent test for presence of blacktopped coating. 
                    Resistance to Solvents                           Marking Permanency testing on inked products. 

                    Materials Analysis:  SEM, EDS,              Analysis of lead finish/solder, metal/ceramic packing composition, stains, and
                          Optical Microscopy                             residues that indicate questionable processing, handling, or storage. 

Non-Invasive Internal Analysis:   Imaging and Hermeticity

                     X-ray Real-Time Imaging                       Presence/size of die; Device and wire-bond workmanship. 

                     Scanning Acoustical Microscopy         Presence/size of die; Quality of molding (delamination). 

Internal Visual Inspection   (Destructive Physical Analysis)

                     Decapsulation/                                        Several methods are available to expose the die and other internal components
                      Delidding of Packages                             of the device. 

                     Visual Inspection                                     Composition of die logos, part numbers, and other internal identification features.
                                                                                         Inspection of die for critical dimensions and workmanship, including wire-bond quality. 

Electrical Parametric Testing                       

                                         When required, parametric testing is normally the final step in the detection process because
                                             it can be the most time consuming to perform. 

                                        Electrical parametric testing can include DC testing at 25
°C and other appropriate temperatures, 
                                             functional testing at 25°C, and burn-in.