Xray Imaging of Devices
IC Real-time Xray imaging is the nondestructive, internal examination of devices and packages. Samples ranging from low-density plastic packages to higher-density steel can be viewed with a high degree of detail.
Applications for IC package Xray Imaging are wide-ranging in the type of samples that can be examined from a variety of industries. Within the microelectronics industry, for example, device X-ray imaging serves to detect defects such as wirebond problems, package cracks and voids, and die attach voids. Internal IC imaging of devices is often an important technique used in conjunction with other analytical processes. IC radiographic inspection is also becoming increasingly important as one of the final steps when performing counterfeit detection.
Silicon Cert Laboratories’ FeinFocus real-time Xray imaging system can inspect samples while being moved, rotated or tilted at the sub-micron level. This allows for an immediate and thorough analysis of structures with varying densities. It operates on the principle of dissimilar transmission of xrays through different density materials creating an image of various contrasts. The filament within the system produces an electron beam used to excite a target into producing Xrays. The Xray emissions are then directed to and transmitted through the sample. The resultant transmitted xrays are collected by a detector, translated into electric signals, amplified and transformed into an Xray image.