IC Preconditioning Testing

Preconditioning testing utilizes JESD22-A113, an industry standard test method, for preconditioning sequence of non-hermetic solid state surface mount devices (SMDs) that are subjected to multiple solder reflow operations. SMDs should be subjected to the appropriate IC preconditioning sequence referenced in the JEDEC document prior to being submitted to specific reliability testing to evaluate the long term reliability.

Prior to subjecting the SMD part to the IC preconditioning testing sequence, the device’s desired moisture sensitivity level (MSL) must first be established.   This MSL level will determine acceptable storage times for unsealed devices awaiting assembly. The IC preconditioning test should be performed at the highest temperature that the SMD is expected to encounter during the actual surface mount assembly process.  Silicon Cert Laboratories are experts with IC Preconditioning Testing.


Test Specifications / Standards