IC Preconditioning Testing
Preconditioning testing utilizes JESD22-A113, an industry standard test method, for preconditioning sequence of non-hermetic solid state surface mount devices (SMDs) that are subjected to multiple solder reflow operations. SMDs should be subjected to the appropriate IC preconditioning sequence referenced in the JEDEC document prior to being submitted to specific reliability testing to evaluate the long term reliability.
Prior to subjecting the SMD part to the IC preconditioning testing sequence, the device’s desired moisture sensitivity level (MSL) must first be established. This MSL level will determine acceptable storage times for unsealed devices awaiting assembly. The IC preconditioning test should be performed at the highest temperature that the SMD is expected to encounter during the actual surface mount assembly process. Silicon Cert Laboratories are experts with IC Preconditioning Testing.
Test Specifications / Standards
Moisture Soak Requirements
Level Floor Life Time Floor Life Condition Standard Soak Time Standard Soak Condition
1 Unlimited ≤ 30°C/85% RH 168 hours 85°C/85% RH
2 1 year ≤ 30°C/60% RH 168 hours 85°C/85% RH
2A 4 weeks ≤ 30°C/60% RH 696 hours 30°C/60% RH
3 168 hours ≤ 30°C/60% RH 192 hours 30°C/60% RH
4 72 hours ≤ 30°C/60% RH 96 hours 30°C/60% RH
5 48 hours ≤ 30°C/60% RH 72 hours 30°C/60% RH
5A 24 hours ≤ 30°C/60% RH 48 hours 30°C/60% RH
6 Time on Label (TOL) ≤ 30°C/60% RH TOL 30°C/60% RH
Note: An accelerated equivalent moisture soak may be used, but with CAUTION, as noted in the IPC/JEDC J-STD-202 Standard.