Temperature Cycling Testing


During temperature cycling testing, mismatch of thermal coefficients of expansion of materials used in electronic and optoelectronic components are among the leading contributors to the failure of equipment exposed to extreme temperature variations.  Repeated exposure to cyclic temperature variations can fatigue joints of different materials and cause them to fail.  Conducting the temperature cycling  test (air-to-air) on these components will assist in determining

      1) the existence of thermal coefficient mismatch and

      2) the sensitivity of these mismatches to repeated temperature excursions. 

Along with temperature extremes, the temp cycle test is performed in chambers that control number of cycles, dwell times, transfer times, or ramp rates.   Elevator-type chambers are used when ramp rates between the low temperature and high temperature extremes must occur at a fairly rapid rate (for MIL-STD-883, test method 1010, for example).  If a slower ramp rate between temperature extremes is required, a temperature cycle test chamber with a single chamber is best suited.  By using a single-chamber piece of equipment the chamber can be set for a specified, slower ramp (for example, 10°C per minute).   Silicon Cert Laboratories are has the engineering expertise with Temperature Cycle testing.

Test Specifications / Standards