Temperature Cycle Testing
Temperature Cycle Testing is performed by our group of experts at Silicon Cert Laboratories. During temperature cycle testing, mismatch of thermal coefficients of expansion of materials used in electronic and optoelectronic components are among the leading contributors to the failure of equipment exposed to extreme temperature variations. Repeated exposure to cyclic temperature variations (-70°C to 200°C) can fatigue joints of different materials and cause them to fail. Conducting the temperature cycling test (air-to-air) on these components will assist in determining the following:
1) the existence of thermal coefficient mismatch
2) the sensitivity of these mismatches to repeated temperature excursions
Along with temperature extremes, the temp cycle test is performed in chambers that control number of cycles, dwell times, transfer times, or ramp rates. Elevator-type chambers are used when ramp rates between the low temperature and high temperature extremes must occur at a fairly rapid rate, for example MIL-STD-883 method 1010. If a slower ramp rate between temperature extremes is required, a temperature cycle test chamber with a single chamber is best suited. By using a single-chamber piece of equipment the chamber can be set for a specified, slower ramp (for example, 10°C per minute).
Power Temperature Cycle is temperature cycle testing that also includes operationally electrically biasing devices under the conditions of -65°C to 150°C.
SCL is very knowledgeable with temp cycle testing. Standards used include mil std 750 method 1051, mil std 750 method 1055, and mil std 883 method 1010. Contact Silicon Cert Laboratories for engineering expertise about Temperature Cycling Testing.
Power Temperature Cycle Test Specifications / Standards
MIL-STD-883 Method 1007
Temperature Cycle Test Specifications / Standards
MIL-STD-750 Method 1051
MIL-STD-750 Method 1055
MIL-STD-883 Method 1010