Temperature humidity testing, also known as damp heat or “85/85,” is performed for the evaluation of electronic, plastic, and metal products in humid environments. High temperature and humidity are often the root cause of product failures. They accelerate corrosion, the wear of moving parts, and the diffusion of moisture through plastic moldings.
When bias is added to temperature and humidity (THB), electro-corrosion can occur in the presence of ionic contamination. Applying bias is designed to simulate the conditions of the device in its real-life applications, providing electric fields between the different metal conductors in the product. Increasing the levels of temperature, humidity, and bias accelerates the different failure modes in time, therefore predicting product failures in much reduced timeframes. This testing can potentially reveal design or manufacturing process flaws.